PCB Facility Overview
Our PCB manufacturing capabilities cover multilayer, HDI and heavy copper boards, with 2–30 layers and finished board thicknesses from 0.2 to 4.0 mm. Materials, stack-ups and surface finishes are selected according to each project’s electrical, thermal and mechanical requirements.
Manufacturing processes include imaging, multilayer lamination, mechanical and laser drilling, copper plating, solder mask application and precision routing. These processes support PCB requirements across industrial control, communications, automotive, medical and consumer electronics.
AOI, electrical testing, dimensional measurement and microsection analysis support manufacturing quality control. From prototypes to volume production, we coordinate engineering review, process planning and inspection requirements to meet the approved specifications.
• PCB Equipment
Laser direct imaging, multilayer lamination, mechanical and laser drilling, copper plating, via filling, solder mask processing, routing and V-cutting. Inspection resources include AOI, flying probe and fixture-based electrical testing, dimensional measurement and microsection analysis.
chemical pretreatment line
developing etching stripping line
inline automated optical inspection
inner layer exposure machine
oxide alternative treatment line
pcb coating machine
pcb edge grinding machine
pcb panel cutting machine
JakoSmart
info@jakosmart.com
USA: +1 586 367 1173
CHINA:+86 137 5114 3913
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