IC Substrate Facility Overview

Our IC substrate manufacturing support covers BT and ABF packaging substrates for memory, sensors, MEMS, RF and flip-chip applications. Materials, build-up structures and interconnect requirements are reviewed against each customer’s package design.

Manufacturing processes include fine-line imaging, laser drilling, metallization, copper plating, build-up lamination, solder mask processing and surface finishing. AOI and electrical testing support verification of circuit features and connectivity.

From sample builds to volume production, Jakosmart coordinates engineering review, manufacturing resources and inspection requirements. Production, sample and qualification capabilities are evaluated separately, with final specifications confirmed for each project.