Machines & Equipment

Manufacturing and inspection equipment supporting PCB, IC substrates and PCBA.

PCBA Facility Overview

Located in Shenzhen Autoshan High-tech Industrial Park, our factory spans 110,000 square feet with workshops and dormitories, certified by ISO9001, IATF 16949, ISO 13485 and RoHS.

We have 350 employees, including professional management, engineering, production and QC teams. Our product portfolio covers intelligent lighting, industrial control, high-power supply, automotive electronics, 4G communication modules and medical electronics.

Equipped with advanced SMT, DIP, assembly, coating and full set of testing lines, supported by complete laboratory environmental test and precision inspection equipment to ensure stable mass production and reliable quality.

Core Capabilities & Competitive Advantages

Engineering and Production Coordination:We coordinate design-file review, manufacturing requirements and production planning for PCB, IC substrates and PCBA projects.

Extensive supply chain and sourcing capability: We have an experienced and professional procurement team that constantly identify and purchase more cost- effective materials and OEM services to constantly create more value for our clients

Proven, agile and global management capability: Our management team had proven to meet clients’ strategic demand, be it technical, financial or geographic, with consistently positive recognitions, over the past 20+ years.

Our Equipment

Equipment supporting board fabrication, IC substrate processing and PCBA assembly.

• PCB Equipment

Laser direct imaging, multilayer lamination, mechanical and laser drilling, copper plating, via filling, solder mask processing, routing and V-cutting. Inspection resources include AOI, flying probe and fixture-based electrical testing, dimensional measurement and microsection analysis.

chemical pretreatment line

developing etching stripping line

inline automated optical inspection

inner layer exposure machine

oxide alternative treatment line

pcb coating machine

pcb edge grinding machine

pcb panel cutting machine

• IC Substrate Processing Equipment

Laser drilling, desmear and metallization, copper plating, fine-line imaging, resin plugging, build-up processing, surface finishing, AOI and electrical testing. Bumping-related processes are reviewed according to package requirements.